Chemical giant Dow has introduced three new silicone technologies for EV electronics applications. The products—DOWSIL TC-2035 CV Adhesive, DOWSIL TC-4551 CV Gap Filler and DOWSIL TC-4060 GB250 Thermal Gel—are designed for reliable performance, high thermal conductivity, efficient heat dissipation and easy processing.
“EVs require material technologies that optimize their sophisticated electronics, including power electronics and advanced driver assistance systems,” said e-Mobility Marketing Manager Luc Dusart. “With decades of proven expertise, Dow continues to expand our silicone material solutions to meet the industry’s fast-changing requirements and regulations by providing greater reliability, safety and performance.”
Dow says its DOWSIL TC-2035 CV Adhesive delivers high thermal conductivity, a fast cure and room temperature shelf life stability for the assembly of automotive electronics, including advanced driver assistance systems (ADAS) units and electronic control units (ECUs). DOWSIL TC-4551 CV Gap Filler also provides high thermal conductivity and reliable performance in automotive power electronics, ECUs and ADAS.
Both the adhesive and the gap filler feature controlled volatility, which helps to avoid electrical contact failure that can occur due to the evaporation of volatiles.
The third new product, DOWSIL TC-4060 GB250 Thermal Gel, provides thermal conductivity of 6 W/m.K. Its heat dissipation and dispensing properties make it suitable for applications such as converters, inverters and onboard chargers. This soft thermal gel also supplies stress relief and shock damping, and performs under high-power and high-temperature conditions.